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Brief Technical Specifications

  • Targeted materials: any type of semiconductor-based light-emitting material systems. EpiEL mapping system has been extensively tested on nitride-based material systems. We offer sample test with no charge on other materials.

  • Wafer size: standard for 2-, 3-, 4- inches wafers; up to 12- inches can be customized (might need longer lead time).

  • Stage motion control: accuracy<16 um, step resolution <0.5 um.

  • Light detection: standard for transmission mode; reflection mode  will be optional (for samples with opaque substrates).

  • Probe type: Type I and Type II.

  • Probe Station: Lab- or Production- version

  • Scanning speed: about 10-20 minutes per 100 sampling points.

  • Sampling points: number of sampling points and optical/electrical measurements for each point can be specified by end user.

  • Test mode: quick EL or EL mapping.

  • Type of mappings*: slope efficiency, peak/dominant wavelength (WLP/WLD), FWHM, EL emissive intensity, current/voltage at given voltage/current, emissive intensity at given driving current or specific wavelength, turn-on voltage, etc (corresponding software can be customized for special requirement of customers).

  • Type of curves*: EL spectra at specific current/voltage, current or emissive intensity vs. voltage (LIV), output intensity vs. driving current, peak/dominant wavelength (WLP/WLD) & FWHM vs. driving current, etc.

  • Mapping color encoding: rainbow, gradient, binary, temperature,  gray, or any type specified by end user.

  • Wavelength detection: UV/VIS or VIS/IR, or customized.

  • Current measurement: standard >10e-6A, optional >10e-12A.

  • Options: PL characterization (for EpiEL-300), enhanced electrical characterization (for EpiEL-500), duo-EL-detection (for EpiEL-700), Reverse leakage, LD

*Note: measured voltage value is slightly higher than that of corresponding finished devices.


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