Wafer Bowing/Warpage Test of MaxMile EpiEL System
MaxMile EpiEL probe can be enabled to probe wafer surface position. Due to this capability, wafer bowing or warpage information can be extracted during regular EpiEL test. Wafer bowing or warpage information can be used to evaluate wafer internal stress as well as possible influence on device processing.
Warpage mapping of a 4 inches blue LED wafer
EpiEL wafer bowing or warpage data extraction is associated with EpiEL test; it is not available for MaxMile PL only mapping system.
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